Wed 10 July, 2019

Intel unveils new 3D chip packaging design

2019-07-25T20:45:28+03:00Wed 10 July, 2019|Tags: , |

Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections ahead of the Semicon West conference in San Francisco this week. The company is detailing its Embedded Multi-Die Interconnect Bridge (EMIB) technologies and Foveros 3D chip packages. This may so..

Thu 23 May, 2019

Benchmarks of forthcoming Epyc 2 processor leaked

2019-05-27T12:52:44+03:00Thu 23 May, 2019|Tags: , |

Benchmarks of engineering samples of AMD's second-generation Epyc server, code-named “Rome,” briefly found their way online and show a very beefy chip running a little slower than its predecessor. Rome is based on the Zen 2 architecture, believed to be more of an incremental improvement over th..

Mon 13 May, 2019

HPE’s CEO lays out his technology vision

2019-05-18T16:23:40+03:00Mon 13 May, 2019|Tags: , , , , , , , , , , , |

Like Microsoft's Satya Nadella, HPE CEO Antonio Neri is a technologist with a long history of leading initiatives in his company. Meg Whitman, his former boss at HPE, showed her appreciation of Neri’s acumen by promoting him to HPE Executive Vice President in 2015 – and gave him the green light..